Each material has different thermal conductivity, which is arranged from high to low, are silver, copper, aluminum and steel.

The Tungsten copper, Molybdenum copper, CMC and CPC materials combine the low thermal expansion rate of Tungsten and Molybdenum with the high thermal conductivity of copper to effectively release heat from electronic devices and help cool IGBT modules, RF power amplifiers, LED chips and other products. It can be used in large scale integrated circuits and high power microwave devices as insulating metal substrates, thermal control boards, heat dissipation elements (heat sinks materials) and lead frames